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Polyethylene Glycol Copper Plating Process Carrier / Wetting Agent

Jiangsu Mengde New materials Technology Co.,Ltd.
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Polyethylene Glycol Copper Plating Process Carrier / Wetting Agent

Brand Name : Mengde

Model Number : PEG 6000-10000

Certification : ISO9001

Place of Origin : China

MOQ : 500kg

Price : Negotiation

Payment Terms : T/T

Supply Ability : 5 MT per month

Delivery Time : 20 working days after received your payment

Packaging Details : Packed in a carboard drum with plastic inner bags

Product Code : PEG

Molecular Formula : HO(CH2CH2O)nH

Molecular Weight : 6000-10000

CAS No. : 25322-68-3

Assay (HPLC) : ≥99%

Applications : Carrier and wetting agent for acid copper baths

Appearance : White crystal

Solubility : Good solubility in water

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PEG, Electroplating intermedaite for acid copper, Polyethylene glycol, carrier, wetting agent

Specifications


Molecular FormulaHO(CH2CH2O)nH
Assay (HPLC)≥99%
Molecular Weight6000-10000
CAS No.25322-68-3
Content in Baths0.05-0.1g/L
Consumption0.4-0.6g/KAH
AppearanceWhite crystal

Description


  1. PEG must be used in combination with other acid copper intermediates, such as SPS, M and N, to get brightening deposit.
  2. A low content of PEG in acid copper baths can cause brightness and leveling reduced, a excessive content of PEG in baths can remarkably reduce the adhesion.

Applications


PEG can be combined with other acid copper intermediates such as M, N, SPS, MT-580, AESS, etc.
PEG can be applied on the following process:

  • Non-dye based bright acid copper for GMF process
  • Acid copper for PCB (Printed Circuit Board) process
  • Hard copper process
  • Acid copper for electrolytic copper foil process

Packing and Storage


Packed in a carboard drum with plastic inner bags, stored in cool and dry place​.


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granular wetting agent

      

organic wetting agent

      
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